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THT vs SMT: Difference between the two?

1.What is THT soldering?

THT (Through-Hole Technology) refers to the process and technology of inserting the leads of components into the circuit board and then soldering them firmly. THT uses leaded components, circuit connection lines and mounting holes designed on the printed board. By inserting the component leads into the reserved through holes on the PCB, temporarily fixed and soldered on the other side of the substrate, a reliable solder joint is formed and a long-term mechanical and electrical connection is established.

A. Advantages of THT soldering:

 

 THT soldering creates a stronger bond between the component and the circuit board, making it ideal for large components that need to withstand high power, high voltage and mechanical stress, including: transformer, connector and semiconductor.

Through holes provide secure physical connection, thermal resistance and power handling functions. The PCB board will be more durable.

 

B. Disadvantages of through-hole technology

 

It requires drilling holes in the PCB

Drilling holes in PCB is expensive

Drilling holes in PCB is time-consuming

It limits the routing area on a multilayer board

Through holes are more expensive

Through holes need to be soldered on both sides of the PCB, making the process more lengthy

2.What is SMT soldering?

SMT refers to the processing on the basis of PCB, and PCB refers to printed circuit board.

 

SMT is surface mount technology, which is the most popular process and technology in the electronic assembly industry, electronic circuit surface assembly technology, called surface mount technology. It is a circuit assembly technology that mounts the surface mount components without leads or with short leads on the surface of the printed circuit board or the surface of other substrates, and then soldering and assembles them by soldering technology.

Since our electronic products are composed of various styles of circuit boards plus electronic components such as resistors, capacitors, diodes, and triodes according to the designed circuit diagrams, various electrical appliances require various SMT chip processing techniques.

A. The advantages of SMT processing:

SMT has the advantages of compact structure, small size, vibration resistance, shock resistance, good high frequency characteristics and high production efficiency. SMT has occupied an industry-leading position in circuit board assembly technology.

B. Disadvantages of SMT

 

Equipment is more expensive:

 

High inspection difficulty: Due to the small size and many solder joints of most SMD components, it is very difficult to inspect.

 

Easily damaged: SMD parts are easily damaged if dropped

 

Manufacturing Environment: They are very sensitive to ESD and require ESD products for handling and packaging. Usually there is a clean room environment for processing.

For components that will be mechanically stressed, SMT may be unreliable when used as the only method of connecting components to the PCB.

 

3. The difference between SMT and THT soldering:

The difference between SMT soldering and THT soldering is that the former uses SMD assembly technology and the latter uses through-hole lead technology. The former only needs to solder one side of the circuit board, while the latter needs to solder both sides of the circuit board.

 

SMT is easy to assemble and allows components to be assembled in smaller and more precise PCB sizes, while THT enables solid soldering between the circuit board and electronic components.

Since SMT soldering technology is relatively simple and convenient, it is faster, more labor-saving and more affordable in production.

Through the above description, I believe that everyone should have a deep understanding of the soldering process of SMT and THT. SMT is a surface mount component and THT is a soldering process, they both have advantages and disadvantages. Different sodlering techniques need to be selected according to the soldering requirements and the characteristics of the products to be soldering.

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