Specifications:
| Model |
D-0008 |
Model |
G-0008 |
| Name |
AX 138 lead free solder paste |
Name |
AX 183 nano solder paste |
| Brand |
AiXun |
Brand |
AiXun |
| N.W. |
50G |
N.W. |
50G |
| Melting point |
138℃ |
Melting point |
183℃ |
| Element |
No. 4 powder |
Element |
No. 4 power |
Features:
AiXun lead free solder paste has different types in melting points so as to satisfy various soldering needs. The SP-138 degree low temperature paste is a special solder consumable that can be applied to iPhone X/XS/XSMAX middle frame and mainboard tin planting, the lead-free and silver containing formula is benefit for environmental protection. The tin balls it creates are delicate, round and full. It has a good viscosity, no blistering and even no solder bead. The SP-183 degree medium temperature nano flux paste is more suitable for welding and maintenance of after-sales mobile phone motherboard, nano chip, BGA, SMT reballing. It has a strong tin climbing ability, good conductivity and strong tin load capacity, which enables no rework after planting balls.
List of Packing:
1 x AX-138/183℃ PB free solder paste
Packing Details
100boxes/carton
Box dimension: 50*30*30mm
Carton dimension: 210*160*165mm
