Soldering is an important skill for any electronics enthusiast or professional. However, when the tip of your soldering iron won’t tin, it can be a frustrating experience. Tinning your soldering iron tip is essential for optimal performance and a better soldering experience. In this article, we will discuss why your soldering iron tip won’t tin and what you can do to fix the issue.

AiXun Z14 middle frame tin planting stand, 4 in 1 support Iphone 14 full series Easily solve problems like uneven tin balls and bridging!

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The purpose of the soldering iron tip cleaner is to keep the soldering iron tip surface in good condition. The cleaner series includes tools such as wet sponges and scouring pads typically used to remove small amounts of oxide and debris that accumulate during daily use, as well as materials for chemical cleaning and maintenance of soldering iron tips.

In actual maintenance work, we often encounter replacement chips. Since there are many tin spots on the chip (similar to pins), it is inevitable that the tin spots on the chip will be knocked off during the desoldering process of the chip. In this case, the chip needs reballing. In the process of chip tin planting, the temperature control are strictly required. The temperature determines the success or failure of chip tin planting, and it will seriously damage the IC due to overheating.

Poor battery life is a long-standing complaint among smartphone users. It doesn't matter if you're an iOS or Android user; if you use your phone often, the battery is prone to conditions. You can find kinds of questions about iPhone battery performance online.

BGA, full name is "ball grid array". It is to blow the solder balls on the CPU contacts with a heat gun through the ball planting board, and then align them with the main board PCB for heating and soldering. At present, this technology is widely used in notebooks and all-in-one motherboards with embedded CPU. What are the ways of BGA ball planting?

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