Soldering is a very complex process, used to join two non-fused materials together. It melts the solder (filler material) and joins the two metals.

SMT or Surface Mount Technology is an electronic technology used to mount or solder SMD components/SMT devices onto PCB (Printed Circuit Board). This SMT technology is different from other technologies.

After the BGA is removed,the residue of PCB pads should be cleaned, mainly to remove the flux and residue left on the PCB surface after the chip is removed.

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