How to solder with solder paste?

Solder paste is a homogeneous mixture of fine spherical solder powder, flux and adhesive, the unique properties of solder paste make it ideal for jump rings, chain fabrication, hollow items, connecting clasps and earring posts, repair work, and more.

How to use solder paste:

1. Take out the solder paste - remove the bottle cap, we will gently poke the toothpick (or similar tool) prepared in advance.

2. Prepare the area by removing all oil, grease, polish and excess oxide from the joint.

3. Keep the connector as small as possible. The joint should be flat, smooth and free of burrs. The two pieces being soldered should touch, as the solder paste will not fill large gaps.

4. Apply solder paste to the top of the connector. To prevent excessive solder flow from the gap after applying solder to the joint, we operate the soldering action fast and with sufficient pressure between the two joints to reduce the flow of solder paste.

5. Move the torch left and right on the joint to avoid overheating the solder. Let the workpiece heat the solder paste. Do not heat the solder paste directly. You will see the flux spread around the solder as the adhesive "burns off" and the solder paste dries. Now gently move the flame into the join area, continuing to move the torch from side to side.

6. Remove the flame as soon as the solder flows.

AiXun lead free solder paste has different types in melting points so as to satisfy various soldering needs. The SP-138 degree low temperature paste is a special solder consumable that can be applied to iPhone X/XS/XSMAX middle frame and mainboard tin planting, the lead-free and silver containing formula is benefit for environmental protection. The tin balls it creates are delicate, round and full. It has a good viscosity, no blistering and even no solder bead. The SP-183 degree medium temperature nano flux paste is more suitable for welding and maintenance of after-sales mobile phone motherboard, nano chip, BGA, SMT reballing. It has a strong tin climbing ability, good conductivity and strong tin load capacity, which enables no rework after planting balls.