As the electronics industry will still maintain a hybrid PCB assembly model, using SMD electronic components and through-hole electronic components to assemble different types of PCBs, the use of through-hole components will continue in the rapidly evolving future. For through-hole active and passive electronic components, there is no more cost-effective process than wave soldering. Using reflow with solder paste is also preferred for some applications.
The process characteristics of selective soldering can be understood by comparison with wave soldering. The most obvious difference between the two is that in wave soldering, the lower part of the PCB is completely immersed in the liquid solder, while in selective soldering, only some specific areas are in contact with the solder wave. Since the PCB itself is a poor heat transfer medium, it does not heat and melt the solder joints in adjacent components and PCB areas when soldering. Flux must also be pre-applied before soldering. In contrast to wave soldering, the flux is only applied to the lower part of the PCB to be soldered, not the entire PCB. In addition, selective soldering is only suitable for soldering of plug-in components. Selective soldering is an entirely new approach and a thorough understanding of the selective soldering process and equipment is necessary for successful soldering.
The choice of soldering process depends on the combination of electronic components to be soldered. Various soldering processes will complement each other rather than replace them. Even hand soldering won't go away completely.
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