UP200 Lead Free Nano Solder Paste Solder Flux for BGA Reballing Repair Tool

Market Price: US $ 3.74/PC

• Suitable for BGA tin reballing of precise electronics, rework, components soldering and soldering repair

• Exclusive formula, no clean, no corrosion, high permeability, good liquidity, limpid liquid

• Less smoke, no smell, lead free and environmental protection

• Limpid and transparent, strong liquidity

• Good insulativity and high activity, not easy to oxidize



AiXun UP200 solder paste is designed with special lead free formula. It features no-clean, no corrosion, high permeability, good liquidity, limpid liquid, less smoke, no smell, good insulativity and high activity, limpid and transparent liquid, not easy to oxidize, which allow it easily handle with BGA reballing, rework, components soldering and desoldering, soldering repair and other mobile maintenance activities. This nano lead free solder paste is a necessary repair tool for soldering and desoldering works.


List of Packing:

1 x Lead free nano solder paste


Packing Details: 

1pc/box, 100boxes/carton

Box dimension: 

Carton dimension: 

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